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Slit, Surface Treatment, Thermal Laminate for Electronic Materials [Kawamura Sangyo]

Presentation of 4 technical introduction materials: We respond from prototyping to mass production! We also support material procurement. We can accommodate electronic materials that require high functionality, such as those for 5G products.

At Kawamura Industries, we create and provide electronic materials with various functions by integrating slit processing, plasma surface treatment, sputtering processing, thermal lamination, and more. We can handle everything from prototyping to mass production, including material procurement. We also welcome inquiries for small lot requests. 【Our Technologies】 ■ Slit Processing With about 50 years of extensive experience, we can accommodate slit widths from 2mm to 2,000mm. We can process not only in clean rooms but also in yellow rooms. ■ Plasma Surface Treatment Effective for improving the adhesion of low-adhesion films like fluorine films. Our roll-to-roll equipment allows for rapid mass production startup. ■ Thermal Lamination We have a vacuum thermal press capable of handling high temperatures up to 400°C within a clean room. Our laminating machines can also operate in a clean environment from the preparation stage. ■ Sputtering Deposition We possess roll-to-roll equipment. In collaboration with partner companies, we can also perform electrolytic copper plating on sputtered films using roll-to-roll methods. *You can view technical documents and introductory materials regarding the above processing technologies from the "PDF Download" section. Please feel free to contact us with any inquiries.